Technology leader Siemens has signed a memorandum of understanding (MoU) with Hon Hai Technology Group, or Foxconn, to advance smart manufacturing platforms. The collaboration looks to accelerate manufacturing globally by doubling down on Foxconn’s electronic manufacturing services to increase automation and bolster the company’s production of electronic vehicles, employing technologies such as digital twins and artificial intelligence.
Siemens will utilize its extensive portfolio of technologies, such as digital twins, to transform Foxconn’s manufacturing processes while tapping into the Siemens Xcelerator suite for further digital integration. Consequently, using digital twin software, the MoU aims to reduce CO2 emission outputs and enhance energy efficiency workflows in Foxconn factories.
“We believe in the power of ecosystems to drive digital and sustainability transformation and scale technology. Our partnership underscores our commitment to shape the future of electronics manufacturing. We will support customers with greater efficiency and speed due to optimized engineering and manufacturing workflows.” said Roland Busch, CEO of Siemens.
Thus, the collaboration aims to strengthen the Taiwanese company’s sustainability efforts by harnessing Siemens’s proficient technology stack and technical expertise. For more information on the impact of digital twins’ sustainability efforts, check out our news page.
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